According to our planning mentioned in the previous update, we resolved moulds issues and launched pilot production of the small batch(74 items) to understand material, soldering, assembling, testing and package problems during mass production.
It was very exhausting but exciting week of challenges.
These 74 devices will go to Smart Atoms and Foxconn engineers to understand and improve the last issues.
Let’s review what we have done recently.
First of all, we produced LaMetric printed circuit boards.
PCB production process
LaMetric PCB pilot production
For the key electronic components we prepared software tests. Each PCB went through these tests to check components on defects and soldering quality. For example, if Wi-Fi module has short circuit, software test will catch this.
PCB software tests
Usually good preparation and planning help to avoid a lot of problems. Our assembling line is prepared quite well and has a lot of documentation for operators including description of the smallest details.
Assembling line documentation
Because product is innovative, during last week operators have been trained how to assemble the product by engineers who designed the production line.
During assembling process, electronic components might be damaged by hands. Additional tier of software tests is performed to check whether components are not damaged and work as expected.
Software tests after assembling
Failed devices are being marked and sent to repairing line for investigation and rework.
Analysis of failed devices
Some portion of devices should be tested on “long life”. This test is performed to understand whether any issues occur after 24-48 hours of uninterrupted work. Such devices are checked via third tier of software tests when “long life” test is completed.
“Long life” test
At the end of the day, assembled and tested devices are being packaged and ready to use.
Finished devices packaged in master cartons
LaMetric, adapter, plugs, USB cable and quick start guide
After pilot production we created report with the issues during different stages:
- Material and components issues
- PCB production issues
- Assembling issues
- Packaging issues
At the moment we are working on solving these problems. After that we will move to production.
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