Additional consumables will be available through our website. In case we run out of business *knock on wood* we will publish the name of the providers and our method to create our ink and glue composition.
The circuit has been bent around 400 times before the pins on the main chip gave up on us (It was shown at the MakerFaire and everyone wanted to bend it). The resistance to bending depends highly on the size of the components, the concentration of the glue and how strongly you bend the circuits.
For printing, Squink typically uses GERBER files. But if you feel artistic it can also use image files (PNG, JPG, BMP, etc).
For the pick-and-place, Squink uses centroid files to place the components. Otherwise you can manually describe them.
*Whisper* This is totally confidential but we are thinking of using insulating ink as a physical separation to make multiple layers. There are positive results so far but it is still a work in progress.There would be no need to align-glue different layers. It would "3D print" a circuit.
Although it will not be available for this version by the time we ship the machines, we are hoping to sell it as an add-on later on.
Don't see the answer to your question? Ask the project creator directly.