Development update + team structure explained
Dear backers, supporters and friends,
Happy to talk to you again and bring news of MIITOs development. We have just finalized an intense week of meetings and workshops here in Berlin. Same as any other international company- our team has multiple partners distributed in various locations. But this week we all met here at the MIITO office making sure everyone is on track and running towards the same goals with our timeline in the back of their heads. So great to see everyone at the same table and their passion to push the development to the next milestones.
It took a while until we were able to set up a team of professionals with industry experience to cover all the aspects that MIITO will need until it will reach your homes. Right now we can say that we have serious power behind our backs supporting the development and manufacturing from inside and outside of the MIITO team. We thought it would be good to inform you of our current structure.
Current MIITO development team
Development team in house:
- Head of Engineering: management of development efforts
- Head of Manufacturing & Supply: managing supply chain, procurement and manufacturing
- Engineering Assistant: develops testing procedures and manuals, assists in development and system testing
External team members:
- Mechanical engineer [special project: working to minimize disk movement in-application system]
- Thermal-Mechanical Analyst [special project: supporting thermal insights & consideration, basic calculations]
Development team - research institute:
- Lead Project Manager : leads the MIITO project management of development effort
- Supporting Project Manager
- Lead contact regarding: certification, regulatory and testing requirements, and patent research
- Lead contact regarding: coil and system simulation, applied mathematics + electrical engineering
Team - MIITO Manufacturing and prototyping partner:
- CEO [oversight of MIITO development effort and manufacturing, background in electrical engineering & manufacturing induction cooktops, kitchen electronics]
- Project Manager [leads the MIITO development effort and electronics components manufacturing]
- Head of Engineering [leads the MIITO development effort]
Development focus: August- October
- Our research institute has developed the first 2.5D simulation to find a favorable coil design. The software that was used to simulate the coil design and the system interaction- between coil and power electronics- is really sophisticated and a small start up like us could never afford to work with such an advanced technology if there wouldn't be for our partnership with the research institute. We have asked to share with us some screenshots of the simulations that we could also share with you.
- We have received 2 coil designs as a result of the simulations. We have reviewed the simulation results and the proposed coil designs, and ordered the materials required to make and test the coils.
- Next: Wind the coil based upon the result and then we run tests to validate the simulation outcomes we've received from our development partner. In the next few weeks we will wind the first coils and test the system to understand what adjustments need to be made to both the electronics and the coil itself. This process will be iterative, with improvements expected as we learn more about ideal operating conditions. This time we have specially requested videos that we could share also with you so stay tuned for the next update!
Lab Set Up
Our manufacturing partner have sent us a copy of their test set up of MIITO so we can do parallel tests in both locations. Now we are setting up a little lab corner to be able to run tests on the new coil design and experiment with the rod movement prototypes.
Issues mentioned in the previous update
Temperature measurement: In last month's update we let you know that we are working on a way to measure temperature that helps us achieve the objective of precise temperature measurement, but without the time and prohibitive costs of additional certification requirements. We have now included the updated temperature measurement components in our bill of materials and will soon have sources of supply confirmed. Stay tuned for pictures in the coming months.
Rod movement: Our team now includes inputs from mechanical engineers focused specifically on addressing disk/ rod movement. We are reviewing possible suppliers of surface treatments and machined modifications so that we have production-processed parts for testing together with our system. Next update: test results and videos of the improvements of the disk movement.
MIITO Hardware evolution
Few of our backers have asked for deeper insight and visuals that would demonstrate the past development of MIITO hardware. So far we have always been very careful what exactly we show in our updates because of two reasons:
- Fear of copying. All the information we share with you is absolutely public to any of our competitors. Giving away too much crucial information of the unique development we are going through might backfire.
- So far we have had the wrong mindset of always wanting to communicate achieved milestones instead of little steps along the way. This has been a problem from our side wanting to show new and better things each time but as we have learnt along the way- actual milestones happens with big time gaps and our backers are interested to see any tests and prototypes instead of just waiting for the perfect final MIITO. We will try to improve this and we have also asked our partners to share with us photos and vidoes of the progress done in their labs that could be shared with you.
With this thought in mind, we looked back at the videos and photos we have done along the way and decided to share some additional material of MIITO development. We hope you will enjoy the addition insights!
Your Friends at MIITO
First Prototype inside the MIITO housing. Takes more than 5 minutes to bring water to boil.
Wireless Rod prototype with temperature measurement
High power prototype developed during the second half of 2015 to optimize efficiency powered from the mains
High-power PCB with placed components